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Flexible And Lightweight PI Heating Film For Energy Efficient Applications

Flexible And Lightweight PI Heating Film For Energy Efficient Applications

Brand Name: HB
MOQ: 100rolls
Price: Negotiable
Supply Ability: 10000rolls/week
Detail Information
Place of Origin:
Dongguan China
Certification:
ISO 9001:2015
Item:
Base Material
Specification:
PI (Polyimide) Film
Item:
Thickness
Specification:
0.025T – 0.125T (standard: 0.05T, 0.08T)
Item:
Release Liner
Specification:
PET Release Film
Item:
Roll Width
Specification:
500 Mm, 980 Mm
Item:
Adhesive
Specification:
Flame-retardant Epoxy Heat Press Adhesive
Item:
Color
Specification:
Black, Tea Color
Packaging Details:
Standard Package
Supply Ability:
10000rolls/week
Product Description

Flame-Retardant PI Epoxy Heat Press Adhesive Film

This high-performance bonding material is engineered for demanding industrial environments. Featuring superior adhesion, high-temperature resistance, and chemical resistance, it is specifically designed for automotive and flexible circuit applications.

  • Excellent adhesion and thermal stability
  • High-temperature and chemical resistance
  • Flame-retardant properties
  • Ideal for automotive and flexible circuit integration

Product Attributes

FOB Unit

Square Meter

MOQ

5000㎡

Packaging & Delivery

Heat-seal packaging in cartons; 7-10 days delivery

Technical Specifications

ItemSpecification
Base MaterialPI (Polyimide) film
Thickness0.025T – 0.125T (standard: 0.05T, 0.08T)
Release LinerPET release film
Roll Width500 mm, 980 mm
AdhesiveFlame-retardant epoxy heat press adhesive
ColorBlack, tea color